Macronix has over 25 years experience of excellent in-house design and manufacturing capabilities for long-term commitment and support
Possessing a small chip size, the Wafer-Level Chip Scale Package (WLCSP) solution is one of the most cost-effective and space-efficient packaging options in the industry.
Macronix WLCSP is a true chip-scale package, offering an extremely small footprint. The key advantages include:
WLCSP is the ideal solution for mobile or portable form factor applications, such as mobile phones, tablets, digital cameras, smart watches, bluetooth headsets, and GPS navigation devices.
Please contact your local Macronix sales person for the most suitable solutions that meet your needs.
Macronix provides KGD products for custom System in Package (SiP) solutions requiring small form factor Flash memory. Our KGD products are ideal for diverse applications, such as portable consumer electronics, set-top box, DSC, mobile phones, IoT/wearable devices, automotive devices, GPS, tablets, industrial, networking.